Plasma chamber with erosion resistive securement screws

The present application pertains to plasma treatment chambers such as those used in semiconductor integrated circuit fabrication. An apparatus is provided for treating a wafer under fabrication with an erosive plasma, in a contamination controlled environment. The apparatus includes a chamber for co...

Full description

Saved in:
Bibliographic Details
Main Authors Lee, Ray C, Pang, Te-Hsun, Shu, Tonny, Lee, Birdson
Format Patent
LanguageEnglish
Published 30.04.2002
Online AccessGet full text

Cover

More Information
Summary:The present application pertains to plasma treatment chambers such as those used in semiconductor integrated circuit fabrication. An apparatus is provided for treating a wafer under fabrication with an erosive plasma, in a contamination controlled environment. The apparatus includes a chamber for containing the wafer to be treated by the plasma, and for isolating the wafer from contaminants external to the chamber during treatment. The chamber also includes one or more plasma erosion resistive screws. Each screw has a shaft secured within the chamber so that the shaft is unexposed to the plasma, and a raised head which is integral with, and made of the same material as, the shaft. The head has a continuous, surface shape with a reduced number of edges so as to reduce the accumulation of charge thereon, thereby resisting erosion by the plasma.