Integrated circuit refrigeration device

• Main Author: Scott, Brian A
• Format: Patent
• Language: English
• Published: 09.04.2002

The present invention relates generally to integrated circuit cooling systems, and more specifically to integrated circuit cooling systems employing heat pipes. A heat pipe includes a flow diverter that separates the heat pipe into an evaporator chamber and a condenser chamber. Each of the evaporator chamber and the condenser chamber are coupled to a compressor with a one-way valve. The compressor receives vaporous working fluid from the evaporator chamber, compresses it, and pumps it to the condenser chamber at a higher pressure and temperature. Within the condenser chamber, the working fluid enter a wicking structure and travels around the flow diverter to the evaporator chamber. The compressor can be an acoustic compressor that includes an acoustic resonating chamber. An integrated circuit package can include the combination of the heat pipe and compressor to create a refrigeration cycle that removes heat from an integrated circuit.