Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package
1. Field of the Invention The semiconductor package including a semiconductor element having a first face and a second face which is opposite to the first face an electrode provided on the first face and a conductive lead connected to the electrode comprises an insulating film member provided on the...
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Main Author | |
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Format | Patent |
Language | English |
Published |
19.03.2002
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Online Access | Get full text |
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Abstract | 1. Field of the Invention
The semiconductor package including a semiconductor element having a first face and a second face which is opposite to the first face an electrode provided on the first face and a conductive lead connected to the electrode comprises an insulating film member provided on the second face for connecting the other end of the lead, the lead is bent as oppose to a side face of the semiconductor element and is connected each other with an elastic force between the electrode and the film member a bent part of the lead between the electrode and the film member turns to be a terminal part The circuit board has a connection means, connecting to the terminal unit and having an adequate size for placing the semiconductor package The connection means is constituted of an accommodation groove part or a frame part and a plurality of pattern electrodes and the terminal part is connected between the pattern electrodes |
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AbstractList | 1. Field of the Invention
The semiconductor package including a semiconductor element having a first face and a second face which is opposite to the first face an electrode provided on the first face and a conductive lead connected to the electrode comprises an insulating film member provided on the second face for connecting the other end of the lead, the lead is bent as oppose to a side face of the semiconductor element and is connected each other with an elastic force between the electrode and the film member a bent part of the lead between the electrode and the film member turns to be a terminal part The circuit board has a connection means, connecting to the terminal unit and having an adequate size for placing the semiconductor package The connection means is constituted of an accommodation groove part or a frame part and a plurality of pattern electrodes and the terminal part is connected between the pattern electrodes |
Author | Miyoshi, Tadayoshi |
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References | Tsubosaki et al. (5714405) 19980200 Normington (5281852) 19940100 Wark (5817540) 19981000 (5-291361) 19931100 (59-96759) 19840600 Packard (3294988) 19661200 (7-78925) 19950300 (4-109644) 19920400 (8-250545) 19960900 (360016449) 19850100 |
References_xml | – year: 19920400 ident: 4-109644 – year: 19980200 ident: 5714405 contributor: fullname: Tsubosaki et al. – year: 19950300 ident: 7-78925 – year: 19940100 ident: 5281852 contributor: fullname: Normington – year: 19850100 ident: 360016449 – year: 19840600 ident: 59-96759 – year: 19931100 ident: 5-291361 – year: 19960900 ident: 8-250545 – year: 19981000 ident: 5817540 contributor: fullname: Wark – year: 19661200 ident: 3294988 contributor: fullname: Packard |
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Snippet | 1. Field of the Invention
The semiconductor package including a semiconductor element having a first face and a second face which is opposite to the first face... |
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Title | Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package |
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