Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package

• Main Author: Miyoshi, Tadayoshi
• Format: Patent
• Language: English
• Published: 19.03.2002

1. Field of the Invention The semiconductor package including a semiconductor element having a first face and a second face which is opposite to the first face an electrode provided on the first face and a conductive lead connected to the electrode comprises an insulating film member provided on the second face for connecting the other end of the lead, the lead is bent as oppose to a side face of the semiconductor element and is connected each other with an elastic force between the electrode and the film member a bent part of the lead between the electrode and the film member turns to be a terminal part The circuit board has a connection means, connecting to the terminal unit and having an adequate size for placing the semiconductor package The connection means is constituted of an accommodation groove part or a frame part and a plurality of pattern electrodes and the terminal part is connected between the pattern electrodes