Magnification correction employing out-of-plane distortion of a substrate

The present invention is directed to a method of controlling dimensional relations between an original pattern present in a mold and a recorded pattern formed in a layer of a substrate. In this manner, the size of the recorded patterned may appear to be magnified and/or reduced, when compared to the...

Full description

Saved in:
Bibliographic Details
Main Authors Nimmakayala, Pawan, Sreenivasan, Sidlgata, Choi, Byung-Jin, Cherala, Anshuman
Format Patent
LanguageEnglish
Published 29.07.2004
Online AccessGet full text

Cover

Loading…
More Information
Summary:The present invention is directed to a method of controlling dimensional relations between an original pattern present in a mold and a recorded pattern formed in a layer of a substrate. In this manner, the size of the recorded patterned may appear to be magnified and/or reduced, when compared to the original pattern. To that end, the method comprises defining a region on the layer in which to produce the recorded pattern. The substrate is bent to produce a contoured surface in the region. Dimensional variations in the original pattern are produced by bending the mold, defining a varied pattern. The contoured surface and the mold are provided to have similar radii of curvatures. The varied pattern is then recorded in the layer.