Semiconductor wafer having identification indication

A semiconductor wafer including an identification indication is provided. The wafer includes a convex edge with an upper surface area and a lower surface area. The identification indication is in a marking region which is disposed on a lower side surface of the convex edge. The lower side surface ha...

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Bibliographic Details
Main Authors Kim, Gi-Jung, Choi, Sam-Jong, Cho, Kyoo-Chul, Kim, Yeon-Sook, Han, Shin-Hyeok, Chung, Hoe-Sik
Format Patent
LanguageEnglish
Published 01.07.2004
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Summary:A semiconductor wafer including an identification indication is provided. The wafer includes a convex edge with an upper surface area and a lower surface area. The identification indication is in a marking region which is disposed on a lower side surface of the convex edge. The lower side surface has a wide region where the marking region is located. This wide region has a width that is wider than an upper side surface of the wafer and thus makes a cross-section of a side of the wafer asymmetrical. With the present invention, the entire top surface of the semiconductor wafer can be utilized for a semiconductor chip region and prevents manufacturing problems associated with the uneven nature of the identification indication when the identification is located on the top surface of the wafer.