Controlled impedance for wire bonding interconnects

A die wire bonded to a semiconductor substrate includes insulated signal wire, insulated power wires and uninsulated ground wires between the die and the semiconductor substrate. A conductive material is provided over the signal, power and ground wire bonds which provides an electrical connection be...

Full description

Saved in:
Bibliographic Details
Main Authors Thurairajaratnam, Aritharan, Ranganathan, Ramaswamy
Format Patent
LanguageEnglish
Published 15.04.2004
Online AccessGet full text

Cover

Abstract A die wire bonded to a semiconductor substrate includes insulated signal wire, insulated power wires and uninsulated ground wires between the die and the semiconductor substrate. A conductive material is provided over the signal, power and ground wire bonds which provides an electrical connection between the uninsulated ground wires. The conductive material follows the same profile as the wire bonds and provides a controlled impedance environment for the signal wirebonds.
AbstractList A die wire bonded to a semiconductor substrate includes insulated signal wire, insulated power wires and uninsulated ground wires between the die and the semiconductor substrate. A conductive material is provided over the signal, power and ground wire bonds which provides an electrical connection between the uninsulated ground wires. The conductive material follows the same profile as the wire bonds and provides a controlled impedance environment for the signal wirebonds.
Author Thurairajaratnam, Aritharan
Ranganathan, Ramaswamy
Author_xml – sequence: 1
  givenname: Aritharan
  surname: Thurairajaratnam
  fullname: Thurairajaratnam, Aritharan
– sequence: 1
  givenname: Ramaswamy
  surname: Ranganathan
  fullname: Ranganathan, Ramaswamy
BookMark eNqVyj0OwjAMBtAMMJSfO2RlQLIo0ANUIA7AXoXERZbC5ygx4vosXIDpLW_lFlBw5_pRYVVz5uTlVTgFRPazVv-Ryv6hSIKnFxjXqABHaxu3nENuvP25drvr5T7e9u9WgjGsTaGULDGYKNp0IDoSDUTnU__P_QKreTWS
ContentType Patent
DBID EFI
DatabaseName USPTO Published Applications
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EFI
  name: USPTO Published Applications
  url: http://www.uspto.gov/patft/index.html
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
ExternalDocumentID 20040070065
GroupedDBID EFI
ID FETCH-uspatents_applications_200400700653
IEDL.DBID EFI
IngestDate Sun Mar 05 22:12:27 EST 2023
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-uspatents_applications_200400700653
OpenAccessLink https://patentcenter.uspto.gov/applications/10269586
ParticipantIDs uspatents_applications_20040070065
PublicationCentury 2000
PublicationDate 20040415
PublicationDateYYYYMMDD 2004-04-15
PublicationDate_xml – month: 04
  year: 2004
  text: 20040415
  day: 15
PublicationDecade 2000
PublicationYear 2004
Score 2.5906532
Snippet A die wire bonded to a semiconductor substrate includes insulated signal wire, insulated power wires and uninsulated ground wires between the die and the...
SourceID uspatents
SourceType Open Access Repository
Title Controlled impedance for wire bonding interconnects
URI https://patentcenter.uspto.gov/applications/10269586
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQSQQdmQ4sBXVNU9OAHZSUJAPdRKBC3RSTNDODNLOURDML0N5hXz8zj1ATrwjTCOimMNBemAJgCyuvBLQwMbVIr7S4oCQfvLoSZTYXWCeaWZpamDEzMAPzMqgJ5ObJzcAJVA3WXIxUQbgJMrAFgEWFGJhS80QYjJ0hK8BzUlMUMoEN0xRQ2CoA24cKoKOBFZLywXtJFEBnNRQlg5aaJJcUizJourmGOHvowm2IR3YP6CZH0O3i4GNexRhYgN32VAkGBWDBYWRhmmRpYJIMbLKbGyeaphibmyYDFYPEjY0kGZQImydFjCJpBi7YehJDUxkGlpKi0lRZYFVZkiQHDhsAxQh0Jw
link.rule.ids 230,309,783,876,888,64393
linkProvider USPTO
linkToPdf http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQSQQdmQ4sBXVNU9OAHZSUJAPdRKBC3RSTNDODNLOURDML0N5hXz8zj1ATrwjTCOj2aPBemFxgNtItALqlWK-0uKAkH7y4Eli8QyJeF3L4M-iMwDzQ6QPleTn5iSkBKWn6RuDkaA6qUpkZWEH1LLgz5ObJzcAJNAjYcMsrKUaqOtwEGdgCwKJCDEypeSIMxs6QteE5qSkKmcAmawoo1BWALUcF0KHBCkn54F0mCqBTHIqSQYtQkkuKRRk03VxDnD104TbEI887xyM5yliMgQXYoU-VYFAAFilGFqZJlgYmycDGvLlxommKsblpMlAxSNzYSJJBibB5UsQokmfgCHBxi_fx9POWZuCCLToxNJVhYCkpKk2VBdanJUly4GACAAnhf1o
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Controlled+impedance+for+wire+bonding+interconnects&rft.inventor=Thurairajaratnam%2C+Aritharan&rft.inventor=Ranganathan%2C+Ramaswamy&rft.date=2004-04-15&rft.externalDBID=n%2Fa&rft.externalDocID=20040070065