Controlled impedance for wire bonding interconnects
A die wire bonded to a semiconductor substrate includes insulated signal wire, insulated power wires and uninsulated ground wires between the die and the semiconductor substrate. A conductive material is provided over the signal, power and ground wire bonds which provides an electrical connection be...
Saved in:
| Main Authors | , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
15.04.2004
|
| Online Access | Get full text |
Cover
Loading…
| Summary: | A die wire bonded to a semiconductor substrate includes insulated signal wire, insulated power wires and uninsulated ground wires between the die and the semiconductor substrate. A conductive material is provided over the signal, power and ground wire bonds which provides an electrical connection between the uninsulated ground wires. The conductive material follows the same profile as the wire bonds and provides a controlled impedance environment for the signal wirebonds. |
|---|