Resin composition for high-frequency bonding
A resin composition for high-frequency bonding with a dielectric loss tangent of 0.03 or higher at a frequency of 40 MHz, containing a thermoplastic resin having a melting point of 80° C. to 200° C. in an amount of 70% to 99% by volume, based on the total volume of the composition, and a conductive...
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| Main Authors | , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
12.06.2003
|
| Online Access | Get full text |
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| Summary: | A resin composition for high-frequency bonding with a dielectric loss tangent of 0.03 or higher at a frequency of 40 MHz, containing a thermoplastic resin having a melting point of 80° C. to 200° C. in an amount of 70% to 99% by volume, based on the total volume of the composition, and a conductive material having a volume resistivity of 10
−2
.cm or lower in an amount of 30% to 1% by volume, based on the total volume of the composition. |
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