Plasma apparatus
A plasma apparatus is disclosed, wherein an RF feed through having a stick type not a wire type is used. Accordingly, even if heat is generated at the RF feed through by an applied RF, heat is more easily emitted outwardly than at the conventional wire type. According to this, an impedance of the RF...
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| Format | Patent |
| Language | English |
| Published |
08.05.2003
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| Online Access | Get full text |
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| Summary: | A plasma apparatus is disclosed, wherein an RF feed through having a stick type not a wire type is used. Accordingly, even if heat is generated at the RF feed through by an applied RF, heat is more easily emitted outwardly than at the conventional wire type. According to this, an impedance of the RF feed through is least changed by heat, thereby having a reliability of a process. Also, since the RF feed through is formed at an upper portion of the plasma chamber not at a lateral side, the RF feed through unit including a cooling jacket and an air cooling jacket is easily engaged to the plasma apparatus. In addition, since an outer upper portion of the bell jar is flat, when the RF feed through penetrates an upper center of the bell jar, an area of a contacted part of the RF feed through with the bell jar becomes minimum, thereby having less influence by a bell jar heater. |
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