Process for removing polymers during the fabrication of semiconductor devices

• Main Authors: Bellandi, Enrico, Pipia, Francesco, Alessandri, Mauro
• Format: Patent
• Language: English
• Published: 06.02.2003

The present invention relates to a process for removing post-etch residues or polymers from the surface of semiconductor devices which comprises treating the semiconductor device with an aqueous ammonia or ammonium hydroxide solution, optionally containing ozone for a time sufficient to effectively...