Process for removing polymers during the fabrication of semiconductor devices

The present invention relates to a process for removing post-etch residues or polymers from the surface of semiconductor devices which comprises treating the semiconductor device with an aqueous ammonia or ammonium hydroxide solution, optionally containing ozone for a time sufficient to effectively...

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Main Authors Bellandi, Enrico, Pipia, Francesco, Alessandri, Mauro
Format Patent
LanguageEnglish
Published 06.02.2003
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Abstract The present invention relates to a process for removing post-etch residues or polymers from the surface of semiconductor devices which comprises treating the semiconductor device with an aqueous ammonia or ammonium hydroxide solution, optionally containing ozone for a time sufficient to effectively remove said post-etch residues or polymers from the surface of the semiconductor device and rinsing the semiconductor device with ozonized water, i.e. water enriched with ozone, in which water is preferably deionized (ozone-DIW).
AbstractList The present invention relates to a process for removing post-etch residues or polymers from the surface of semiconductor devices which comprises treating the semiconductor device with an aqueous ammonia or ammonium hydroxide solution, optionally containing ozone for a time sufficient to effectively remove said post-etch residues or polymers from the surface of the semiconductor device and rinsing the semiconductor device with ozonized water, i.e. water enriched with ozone, in which water is preferably deionized (ozone-DIW).
Author Bellandi, Enrico
Pipia, Francesco
Alessandri, Mauro
Author_xml – sequence: 1
  givenname: Enrico
  surname: Bellandi
  fullname: Bellandi, Enrico
– sequence: 1
  givenname: Francesco
  surname: Pipia
  fullname: Pipia, Francesco
– sequence: 2
  givenname: Mauro
  surname: Alessandri
  fullname: Alessandri, Mauro
BookMark eNqVjLsKAjEQRVNo4esfprUQQlYQa1FsBAv7JSYTDSSZkEkW_HtX2B-wOlw49yzFLFHChbjdCxlkBkcFCkYafHpBpvCJWBhsK79d3whOP4s3unpKQA4YozeUbDN1fFoc_JhZi7nTgXEzcSW2l_PjdN01zrpiqtzrnMOU4V5J2UmpDnt17P5xv4FOP6c
ContentType Patent
DBID EFI
DatabaseName USPTO Published Applications
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EFI
  name: USPTO Published Applications
  url: http://www.uspto.gov/patft/index.html
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
ExternalDocumentID 20030027429
GroupedDBID EFI
ID FETCH-uspatents_applications_200300274293
IEDL.DBID EFI
IngestDate Sun Mar 05 22:31:33 EST 2023
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-uspatents_applications_200300274293
OpenAccessLink https://patentcenter.uspto.gov/applications/10189152
ParticipantIDs uspatents_applications_20030027429
PublicationCentury 2000
PublicationDate 20030206
PublicationDateYYYYMMDD 2003-02-06
PublicationDate_xml – month: 02
  year: 2003
  text: 20030206
  day: 06
PublicationDecade 2000
PublicationYear 2003
Score 2.5664883
Snippet The present invention relates to a process for removing post-etch residues or polymers from the surface of semiconductor devices which comprises treating the...
SourceID uspatents
SourceType Open Access Repository
Title Process for removing polymers during the fabrication of semiconductor devices
URI https://patentcenter.uspto.gov/applications/10189152
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMTNNTAKd66RrkJZmBOygmBnoJlpYJuqmWhqkmYJqFMtE8CpfPzOPUBOvCNMI6KYw0F6YAmALK68EtDAxtUivtLigJB-8uhJlNhd0yJQlsN5hZmAG5mVQE8jNk5uBE6garLkYqYJwE2RgCwCLCjEwpeaJMPhC198rAJuECkWpueBuu0JBfk4laJhYAbI3UAHY9lJIS0wqglqpkJ-mUAxaq56fBzqEFagzJRWcj0UZNN1cQ5w9dOF2xyO7FHTHozFkNtTSWIyBBdihT5VgUABmkqS0FIOUVFMLoAywi2KUaAwMsGRg6yotydIoTZJBibB5UsQokmbgAi8-A60yNpNhYCkpKk2VBVaiJUly4FADAJNhfYo
link.rule.ids 230,309,783,876,888,64387
linkProvider USPTO
linkToPdf http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjVw7T8MwED5BQbRMIEAt5WEhFgZDlJIonmmjlkeVAaRukY3tqbWjJBXi33N2IpQNVr9l63z32d99ALdxxIXTdaKB1iEClDigPGGcKhboyHkUxj3LdxnPPx6fV9GqTY_2uTAbNCNa4Fqq-21V1NaTK_F6bw6eNuLPTiPQOPWBL7O2XGZSPziSVfPxyHZhD_1s4mFZujiEPg6EgZupq47rSI9gP_Olx7CjzAm8tcx8gsEiKdXGA3pS2PW3e0AmTdYgwaiMaC7K9kGNWE0qx2K3xsmzYk-pvIWfwl06e3-a09-58-6PdN5Z7uQMegj11RAImo_QMpAqSrAGwUvIJ7iVnxh3acFCPYKbv8c7_0-jazjIpmn-uli-jGHgGWqOihxfQK8ut-oSPW0trvwG_gAb-IjP
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Process+for+removing+polymers+during+the+fabrication+of+semiconductor+devices&rft.inventor=Bellandi%2C+Enrico&rft.inventor=Pipia%2C+Francesco&rft.inventor=Alessandri%2C+Mauro&rft.date=2003-02-06&rft.externalDBID=n%2Fa&rft.externalDocID=20030027429