TIN - COPPER ALLOY ELECTROPLATING BATH AND PLATING PROCESS THEREWITH

A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention makes it possible to form...

Full description

Saved in:
Bibliographic Details
Main Authors YANADA, ISAMU, TSUJIMOTO, MASANOBU, OKADA, TETSUROU, OKA, TERUYA, TSUBOKURA, HIDEYUKI
Format Patent
LanguageEnglish
Published 08.08.2002
Online AccessGet full text

Cover

Abstract A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention makes it possible to form a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts such as chips, quartz crystal oscillators, hoops, connector pins, lead frames, bumps, lead pins of packages, and printed circuit boards.
AbstractList A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention makes it possible to form a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts such as chips, quartz crystal oscillators, hoops, connector pins, lead frames, bumps, lead pins of packages, and printed circuit boards.
Author TSUBOKURA, HIDEYUKI
OKA, TERUYA
TSUJIMOTO, MASANOBU
YANADA, ISAMU
OKADA, TETSUROU
Author_xml – sequence: 1
  givenname: ISAMU
  surname: YANADA
  fullname: YANADA, ISAMU
– sequence: 1
  givenname: MASANOBU
  surname: TSUJIMOTO
  fullname: TSUJIMOTO, MASANOBU
– sequence: 2
  givenname: TETSUROU
  surname: OKADA
  fullname: OKADA, TETSUROU
– sequence: 3
  givenname: TERUYA
  surname: OKA
  fullname: OKA, TERUYA
– sequence: 4
  givenname: HIDEYUKI
  surname: TSUBOKURA
  fullname: TSUBOKURA, HIDEYUKI
BookMark eNrjYmDJy89L5WRwCfH0U9BVcPYPCHANUnD08fGPVHD1cXUOCfIP8HEESrorODmGeCg4-rkowAQCgvydXYODFUI8XINcwz1DPHgYWNMSc4pTeaE0N4Omm2uIs4duaXFBYklqXklxfGJBQU5mcmJJZn5ecbyRgYGRgaGBibmZsTEpagHJujRe
ContentType Patent
DBID EFI
DatabaseName USPTO Published Applications
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EFI
  name: USPTO Published Applications
  url: http://www.uspto.gov/patft/index.html
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
ExternalDocumentID 20020104763
GroupedDBID EFI
ID FETCH-uspatents_applications_200201047633
IEDL.DBID EFI
IngestDate Sun Mar 05 22:09:49 EST 2023
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-uspatents_applications_200201047633
OpenAccessLink https://patentcenter.uspto.gov/applications/09433887
ParticipantIDs uspatents_applications_20020104763
PublicationCentury 2000
PublicationDate 20020808
PublicationDateYYYYMMDD 2002-08-08
PublicationDate_xml – month: 08
  year: 2002
  text: 20020808
  day: 08
PublicationDecade 2000
PublicationYear 2002
Score 2.5475872
Snippet A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble...
SourceID uspatents
SourceType Open Access Repository
Title TIN - COPPER ALLOY ELECTROPLATING BATH AND PLATING PROCESS THEREWITH
URI https://patentcenter.uspto.gov/applications/09433887
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LS8QwEB7cRVBPiopvgnjxUFmbPtJjt5uaSm1LibiepGmzx3XZ7f5_J0GX9aSnwGTyYCDMfOSbGYA7D1FH1CEs6RqKAMULqKO6NnRa2lHdat9tApPg_FIE4tV7nvrT76QwkwuzwAhr3htiol4-rFeL_tOyK3_95hoyHMXHMYABC22wmGYHsIfadvFqy0Gkh7BbWekR7Oj5MUxkVhCHJGVV8ZrEeV6-E57zRNZllcc4-UTGsRQkLibkR1DVZYLWIFLwmr9lUpzAfcplIpzNkR_bFzStHV1b9yag9BSGiOP1GZBHdzaKWBS0rFGeCmmkmOfOVENHDQ6dfw63f-938R-lS9i3TUsMs4FdwbBfrvU1-s5e3VhjfQHy-HNu
link.rule.ids 230,309,786,879,891,64416
linkProvider USPTO
linkToPdf http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT4QwEJ7oanycNGp82xgvHtBdCiwckS2CIjQE43oiQOGk7EbY-Pedsmq46alJ20wn08f0S2e-AlxpiDosgbBEZBQBimZQJRfFWCmooGVR6mpmyATnp9DwnrWHqT79To_ucmHecRspc9SluVk083bWBVfi8b6ceGVJ_iw5AmvJPvBZv80ywUV1K4MNOq4Zg67CmvTycr0z19-GTRSEF7e6bXquw92Bdd7V7sJKWe_BJPFDohAn4pzFxA6C6JWwgDlJHPHAxsZ7cmcnHrHDCfmp4HHkoJ1I4rGYvfiJtw_XLkscT_kdMu0_RKc9LekBDBDhl4dARmo1tEzLKMws1_IxtXJTU6s8o8MMC6EfweXf8o7_0-kCNvjETQM_fDyBre5nExn-YJ7CoP1YlGfoYNv8vLPbF6vufpY
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=TIN+-+COPPER+ALLOY+ELECTROPLATING+BATH+AND+PLATING+PROCESS+THEREWITH&rft.inventor=YANADA%2C+ISAMU&rft.inventor=TSUJIMOTO%2C+MASANOBU&rft.inventor=OKADA%2C+TETSUROU&rft.inventor=OKA%2C+TERUYA&rft.inventor=TSUBOKURA%2C+HIDEYUKI&rft.date=2002-08-08&rft.externalDBID=n%2Fa&rft.externalDocID=20020104763