TIN - COPPER ALLOY ELECTROPLATING BATH AND PLATING PROCESS THEREWITH

A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention makes it possible to form...

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Bibliographic Details
Main Authors YANADA, ISAMU, TSUJIMOTO, MASANOBU, OKADA, TETSUROU, OKA, TERUYA, TSUBOKURA, HIDEYUKI
Format Patent
LanguageEnglish
Published 08.08.2002
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Summary:A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention makes it possible to form a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts such as chips, quartz crystal oscillators, hoops, connector pins, lead frames, bumps, lead pins of packages, and printed circuit boards.