Integrated circuits protected against reverse engineering and method for fabricating the same using vias without metal terminations
A device adapted to protect integrated circuits from reverse engineering comprising a part looking like a via connecting two metal layers, but in fact attached only to one metal layer and spaced from the other. Having such "trick" via would force a reverse engineer to think there is a conn...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
25.07.2002
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| Online Access | Get full text |
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| Summary: | A device adapted to protect integrated circuits from reverse engineering comprising a part looking like a via connecting two metal layers, but in fact attached only to one metal layer and spaced from the other. Having such "trick" via would force a reverse engineer to think there is a connection where there is none. A method for fabricating such device. |
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