Process for the surface polishing of silicon wafers

• Main Authors: Buschhardt, Thomas, Wenski, Guido, Hennhofer, Heinrich, Lichtenegger, Bruno
• Format: Patent
• Language: English
• Published: 20.06.2002

A process for the surface polishing of a silicon wafer, includes the successive polishing of the silicon wafer on at least two different polishing plates covered with polishing cloth, with a continuous supply of alkaline polishing abrasive with SiO 2 constituents, an amount of silicon removed during...