Process for the surface polishing of silicon wafers
A process for the surface polishing of a silicon wafer, includes the successive polishing of the silicon wafer on at least two different polishing plates covered with polishing cloth, with a continuous supply of alkaline polishing abrasive with SiO 2 constituents, an amount of silicon removed during...
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| Main Authors | , , , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
20.06.2002
|
| Online Access | Get full text |
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| Summary: | A process for the surface polishing of a silicon wafer, includes the successive polishing of the silicon wafer on at least two different polishing plates covered with polishing cloth, with a continuous supply of alkaline polishing abrasive with SiO
2
constituents, an amount of silicon removed during the polishing on a first polishing plate being significantly higher than on a second polishing plate, with the overall amount of silicon removed not exceeding 1.5 m. A polishing abrasive (
1
a
), then a mixture of a polishing abrasive (
1
b
) and at least one alcohol, and finally ultrapure water (
1
c
) are added to the first polishing plate, and a mixture of a polishing abrasive (
2
a
) and at least one alcohol and then ultrapure water (
2
b
) are added to the second plate. |
|---|