Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof

• Main Authors: Jeong, Chang-Oh, Kim, Yang-Sun, Hur, Myung-Koo, Tak, Young-Jae, Hong, Mun-Pyo, Kim, Chi-Woo, Kim, Jang-Soo, You, Chun-Gi
• Format: Patent
• Language: English
• Published: 23.05.2002

The Mo or MoW composition layer has a low resistivity of less than 15 cm and is etched to have a smooth taper angle using an Al alloy enchant or a Cr enchant, and the Mo or MoW layer is used for a wiring of a display or a semiconductor display along with an Al layer or a Cr layer. Since the Mo or MoW layer can be deposited so as to give low stress to the substrate by adjusting the deposition pressure, a single MoW layer can be used as a wiring by itself. When contact holes are formed in the passivation layer or the gate insulating layer, a lateral etch is reduced by using polymer layer, an etch gas system using CF 4 +O 2 can prevent the etch of the Mo or MoW alloy layer, and an etch gas of SF 6 +HCl (+He) or SF 6 +Cl 2 (+He) can form the edge profile of contact holes to be smoothed. Also, when an amorphous silicon layer formed under the Mo or MoW layer is etched using the Mo or MoW layer as a mask, using an etch gas system that employs a gas such as hydrogen halide and at least one gas selected from CF 4 , CHF 3 , CHClF 2 , CH 3 F, and C 2 F 6 , yields good TFT characteristics, and H 2 plasma treatment can further improve the TFT characteristics.