Integrated connector and semiconductor die package

• Main Authors: Krishnapura, Lakshminarasimha, Crane, Stanford, Dutta, Arindum
• Format: Patent
• Language: English
• Published: 14.02.2002

An integrated module includes a connector for detachable connection to a signal source, with the connector having internal electrically conductive pins, and a housing defining a cavity for holding at least one semiconductor die. The housing includes side walls and an end plate joined to the side walls. Electrically conductive leads extend through at least one of the side walls with each of the leads including an internal lead section extending within the cavity and an external lead section extending externally of the cavity through at least one side wall. One of the side walls of the housing includes a portion that is attached to the connector, with the side walls and a bottom part of the connector being formed as one integrally molded part or as two separate parts that are joined together using processes such as ultrasonic welding. A printed circuit board can also form part of the integrated module, with the printed circuit board either being mounted in spaced parallel relation to the end plate on pegs that extend upwardly from the side walls of the housing, or the printed circuit board can be mounted between the connector and the housing either perpendicular to or parallel with the end plate of the housing. Passive components can be mounted on the printed circuit board and electrically connected to pins within the connector as well as to semiconductor dies mounted on the end plate within the housing. The electrically conductive leads extending from the side wall on one side of the integrated module can be offset relative to the electrically conductive leads extending from the opposite side wall such that two identical integrated modules can be mounted close to each other with the electrically conductive leads overlapping, thus optimizing space utilization.