SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE MOUNTED ON CIRCUIT BOARD AND METHOD OF ASSEMBLING SEMICONDUCTOR PACKAGE
The semiconductor package including a semiconductor element 11 having a first face 21 a and a second face 21 b which is opposite to the first face 21 a, an electrode 22 provided on the first face 21 a, and a conductive lead 23 connected to the electrode 22 comprises an insulating film member 24 prov...
Saved in:
| Main Author | |
|---|---|
| Format | Patent |
| Language | English |
| Published |
03.01.2002
|
| Online Access | Get full text |
Cover
Loading…
| Summary: | The semiconductor package including a semiconductor element
11
having a first face
21
a
and a second face
21
b
which is opposite to the first face
21
a,
an electrode
22
provided on the first face
21
a,
and a conductive lead
23
connected to the electrode
22
comprises an insulating film member
24
provided on the second face
21
b
for connecting the other end of the lead, the lead
23
is bent as oppose to a side face of the semiconductor element
11,
and is connected each other with an elastic force between the electrode
22
and the film member
24,
a bent part of the lead between the electrode
22
and the film member
24
turns to be a terminal part
23
a.
The circuit board has a connection means, connecting to the terminal unit
23
a,
and having an adequate size for placing the semiconductor package
11.
The connection means is constituted of an accommodation groove part
46
or a frame part
50,
and a plurality of pattern electrodes
47
a,
47
b,
and the terminal part
23
a
is connected between the pattern electrodes
47
a,
47
b. |
|---|