Light emitting diode with a permanent substrate of transparent glass or quartz and the method for manufacturing the same

A method of manufacturing a light emitting diode (LED) includes growing a light emitting region on a temporary substrate, bonding a transparent substrate of glass or quartz to the light emitting region and then removing the temporary substrate. A metal bonding agent also serving as an ohmic contact...

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Bibliographic Details
Main Authors Chang, Kuo-Hsiung, Lin, Kun-Chuan, Horng, Ray-Hua, Huang, Man-Fang, Wuu, Dong-Sing, Wei, Sun-Chin, Chen, Lung-Chien
Format Patent
LanguageEnglish
Published 06.09.2001
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Summary:A method of manufacturing a light emitting diode (LED) includes growing a light emitting region on a temporary substrate, bonding a transparent substrate of glass or quartz to the light emitting region and then removing the temporary substrate. A metal bonding agent also serving as an ohmic contact layer with LED is used to bond the transparent substrate to form a dual substrate LED element which is then heated in a wafer holding device that includes a graphite lower chamber and a graphite upper cover with a stainless steel screw. Because of the different thermal expansion coefficients between stainless and graphite, the stainless steel screw applies a pressure to the dual substrate LED element during the heating process to assist the bonding of the transparent substrate.