Fe-Pt-Ag-C-Based Sputtering Target Having C Grains Dispersed Therein, and Method for Producing Same

100-XX100-Y-ZYZ An Fe-Pt-Ag-C-based sintered compact sputtering target having a composition represented by a formula (Fe-Pt)-Ag-C(wherein X represents a numerical value satisfying a formula 35≦X≦55; Y represents a numerical value satisfying a formula 0.5≦Y≦15; and Z represents a numerical value sati...

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Format Patent
LanguageEnglish
Published 10.04.2013
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Summary:100-XX100-Y-ZYZ An Fe-Pt-Ag-C-based sintered compact sputtering target having a composition represented by a formula (Fe-Pt)-Ag-C(wherein X represents a numerical value satisfying a formula 35≦X≦55; Y represents a numerical value satisfying a formula 0.5≦Y≦15; and Z represents a numerical value satisfying a formula 15≦Z≦55) when expressed in an atomic ratio, and having a relative density of 93% or more. A method for producing an Fe-Pt-Ag-C-based sintered compact sputtering target, characterized in that an Fe-Pt-C sintered compact is produced in advance, the sintered compact is pulverized to produce a pulverized powder, the pulverized powder is mixed with a Ag powder, and the resultant mixed powder is subject to sintering at a temperature lower than a melting point of Ag. An object of this invention is to provide a high-density sputtering target which enables the production of a magnetic thin film having a granular structure without the use of expensive co-sputtering equipment and which enables the reduction in the amount of particles generated during sputtering.