Oscillating Seebeck coefficients in π-stacked molecular junctionsElectronic supplementary information (ESI) available. See DOI: 10.1039/c8ra04698k

When a linear aromatic molecule within a nanogap is bound only to a source electrode, and an adjacent molecule is bound only to a drain electrode, the two molecules can interact via pi-pi stacking, which allows electrons to flow from the source to the drain, via pi-pi bonds. Here we investigate the...

Full description

Saved in:
Bibliographic Details
Main Authors Al-Khaykanee, Mohsin K, Ismael, Ali K, Grace, Iain, Lambert, Colin J
Format Journal Article
Published 10.07.2018
Online AccessGet full text

Cover

Loading…
More Information
Summary:When a linear aromatic molecule within a nanogap is bound only to a source electrode, and an adjacent molecule is bound only to a drain electrode, the two molecules can interact via pi-pi stacking, which allows electrons to flow from the source to the drain, via pi-pi bonds. Here we investigate the thermoelectric properties of such junctions, using mono-thiol oligo-phenylene ethynylene (OPE3)-based molecules as a model system. For molecules which are para -connected to the electrodes, we show that the Seebeck coefficient is an oscillatory function of the length L of the pi-pi overlap region and exhibits large positive and negative values. This bi-thermoelectric behavior is a result of quantum interference within the junction, which behaves like a molecular-scale Mach-Zehnder interferometer. For junctions formed from molecular monolayers sandwiched between planar electrodes, this allows both hole-like and electron-like Seebeck coefficients to be realized, by careful control of electrode separation On the other hand for meta -connected molecules, the Seebeck coefficient is insensitive to L , which may be helpful in designing resilient junctions with more stable and predictable thermoelectric properties. When two adjacent molecules are slid across each other, quantum interference causes oscillations in their conductance and Seebeck coefficient.
Bibliography:Electronic supplementary information (ESI) available. See DOI
10.1039/c8ra04698k
ISSN:2046-2069
DOI:10.1039/c8ra04698k