Exploiting the interaction between a semiconductor nanosphere and a thin metal film for nanoscale plasmonic devicesElectronic supplementary information (ESI) available. See DOI: 10.1039/c6nr06504j
The interaction of silicon (Si) nanospheres (NSs) with a thin metal film is investigated numerically and experimentally by characterizing their forward scattering properties. A sharp resonant mode and a zero-scattering dip are found to be introduced in the forward scattering spectrum of a Si NS by p...
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Main Authors | , , , , , , |
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Format | Journal Article |
Language | English |
Published |
17.11.2016
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Online Access | Get full text |
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Summary: | The interaction of silicon (Si) nanospheres (NSs) with a thin metal film is investigated numerically and experimentally by characterizing their forward scattering properties. A sharp resonant mode and a zero-scattering dip are found to be introduced in the forward scattering spectrum of a Si NS by putting it on a 50-nm-thick gold film. It is revealed that the sharp resonant mode arises from a new magnetic dipole induced by the electric dipole and its mirror image while the zero-scattering dip originates from the destructive interference between the new magnetic dipole and the original one together with its mirror image. A significant enhancement in both electric and magnetic fields is achieved at the contact point between the Si NS and the metal film. More interestingly, the use of a thin silver film can lead to vivid scattering light with different color indices. It is demonstrated that a small change in the surrounding environment of Si NSs results in the broadening of the resonant mode and the disappearance of the zero-scattering dip. Our findings indicate that dielectric-metal hybrid systems composed of semiconductor NSs and thin metal films act as attractive platforms on which novel nanoscale plasmonic devices can be realized.
The interaction between a semiconductor nanosphere and a metal film can create a sharp resonant mode with a significantly enhanced field. |
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Bibliography: | 10.1039/c6nr06504j Electronic supplementary information (ESI) available. See DOI |
ISSN: | 2040-3364 2040-3372 |
DOI: | 10.1039/c6nr06504j |