Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formationElectronic supplementary information (ESI) available: SEM image of the copper particles used for the CuF-IPA-Cu ink. XRD patterns of solid compounds generated from CuF-DEAE, and TGA-DTA curves of CuF-IPA complex. See DOI: 10.1039/c5ra25058g

• Main Authors: Yonezawa, Tetsu, Tsukamoto, Hiroki, Yong, Yingqiong, Nguyen, Mai Thanh, Matsubara, Masaki
• Format: Journal Article
• Published: 29.01.2016
• ISSN: 2046-2069
• DOI: 10.1039/c5ra25058g

A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 × 10 −6 Ω m). This novel process may open a new strategy in the field of printed electronics. A novel low cost sintering process of copper fine particles to a copper conductive layer with Cu 2+ -alkanolamine metallacycle complexes at as low as 100 °C without reductive gas flow.