Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formationElectronic supplementary information (ESI) available: SEM image of the copper particles used for the CuF-IPA-Cu ink. XRD patterns of solid compounds generated from CuF-DEAE, and TGA-DTA curves of CuF-IPA complex. See DOI: 10.1039/c5ra25058g
A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and...
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Main Authors | , , , , |
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Format | Journal Article |
Published |
29.01.2016
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Online Access | Get full text |
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Summary: | A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 × 10
−6
Ω m). This novel process may open a new strategy in the field of printed electronics.
A novel low cost sintering process of copper fine particles to a copper conductive layer with Cu
2+
-alkanolamine metallacycle complexes at as low as 100 °C without reductive gas flow. |
---|---|
Bibliography: | Electronic supplementary information (ESI) available: SEM image of the copper particles used for the CuF-IPA-Cu ink. XRD patterns of solid compounds generated from CuF-DEAE, and TGA-DTA curves of CuF-IPA complex. See DOI 10.1039/c5ra25058g |
ISSN: | 2046-2069 |
DOI: | 10.1039/c5ra25058g |