Simultaneously Improved Thermal and Dielectric Performance of Epoxy Composites Containing Ti 3 C 2 T x Platelet Fillers
Polymer composites with enhanced thermal and dielectric properties can be widely used in electric and energy related applications. In this work, epoxy composites have been prepared with Ti C T , one of the most studied MXene materials that can be massively produced by direct etching using hydrofluor...
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Published in | Polymers Vol. 12; no. 7 |
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Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
Switzerland
19.07.2020
|
Subjects | |
Online Access | Get full text |
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Summary: | Polymer composites with enhanced thermal and dielectric properties can be widely used in electric and energy related applications. In this work, epoxy composites have been prepared with Ti
C
T
, one of the most studied MXene materials that can be massively produced by direct etching using hydrofluoric acid. The addition of conductive two dimensional Ti
C
T
platelet fillers leads to improved but anisotropic thermal conductivity of the composites. The through-plane thermal conductivity reaches 0.583 Wm
K
and the in-plane thermal conductivity reaches 1.29 Wm
K
when filler content is 40 wt% (21.3 vol%), achieving enhancements of 2.92 times and 10.65 times respectively, as compared with epoxy matrix. The dielectric permittivity of epoxy composite is enhanced by a factor of ~2.25 with 40 wt% fillers, and the dielectric losses are within a small value of 0.02. The results prove the effectiveness of Ti
C
T
in simultaneously improving thermal and dielectric performance of epoxy composites, and it is deduced that further improvements may be obtained by using Ti
C
T
nanoflake fillers. |
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ISSN: | 2073-4360 |