Discontinuities in system-level design

The typical PCB now is likely to include several standard components and off-the-shelf chips, along with programmable logic and support for multiple communications standards. In addition, the use of new packaging technologies such as BGA has added to the challenges for board designers. The use of SO...

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Bibliographic Details
Published inElectronic News Vol. 47; no. 27; p. 8
Main Author Rhines, Walden C
Format Trade Publication Article
LanguageEnglish
Published New York Reed Business Information, a division of Reed Elsevier, Inc 02.07.2001
Subjects
Critical path
Design
Designers
Electronics industry
Product design
Technology
Trends
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Summary:The typical PCB now is likely to include several standard components and off-the-shelf chips, along with programmable logic and support for multiple communications standards. In addition, the use of new packaging technologies such as BGA has added to the challenges for board designers. The use of SOC designs has further increased the overall circuit density requiring advanced board design techniques.
ISSN:1061-6624