Discontinuities in system-level design
The typical PCB now is likely to include several standard components and off-the-shelf chips, along with programmable logic and support for multiple communications standards. In addition, the use of new packaging technologies such as BGA has added to the challenges for board designers. The use of SO...
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Published in | Electronic News Vol. 47; no. 27; p. 8 |
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Main Author | |
Format | Trade Publication Article |
Language | English |
Published |
New York
Reed Business Information, a division of Reed Elsevier, Inc
02.07.2001
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Subjects | |
Online Access | Get full text |
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Summary: | The typical PCB now is likely to include several standard components and off-the-shelf chips, along with programmable logic and support for multiple communications standards. In addition, the use of new packaging technologies such as BGA has added to the challenges for board designers. The use of SOC designs has further increased the overall circuit density requiring advanced board design techniques. |
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ISSN: | 1061-6624 |