Quick Acoustic Methods for Part Verification
Acoustic microscopes traditionally look for delaminations and similar internal defects in components. Nowadays, they are being used as quick material characterization tools to verify incoming parts as a matter of supply chain management - a type of verification that is critical to any assembler, but...
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Published in | Semiconductor International Vol. 29; no. 9; p. SP11 |
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Main Author | |
Format | Trade Publication Article |
Language | English |
Published |
Newton
Reed Business Information, a division of Reed Elsevier, Inc
01.08.2006
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Subjects | |
Online Access | Get full text |
ISSN | 0163-3767 |
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Summary: | Acoustic microscopes traditionally look for delaminations and similar internal defects in components. Nowadays, they are being used as quick material characterization tools to verify incoming parts as a matter of supply chain management - a type of verification that is critical to any assembler, but especially to fabless companies. The manufacturer of an IC generally makes the assumption that the packaging process coming from suppliers or their own factories meets specifications. In cases where this assumption carries some risk, engineers may use acoustic microscopes to investigate incoming plastic-packaged ICs for structural defects, primarily delaminations, cracks and the like. Where the economic impact of such defects is fairly modest, a low percentage of incoming parts may be imaged acoustically; where the potential economic impact is very high (as with high-end microprocessors), all incoming parts may be subject to high-resolution acoustic imaging inspection. |
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ISSN: | 0163-3767 |