Thermal modeling and simulation of PCBs in a CAD integrated design flow

Thermal analysis of printed circuit board designs is a critical part of the overall design validation process for electronic products. There are several objectives in performing PCB level thermal analysis simulation: 1. to determine if the board or components exceed manufacturing specifications, 2....

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Bibliographic Details
Published inPrinted circuit design Vol. 16; no. 10; p. 17
Main Authors Wellers, Fred, Tomasek, Rob
Format Journal Article
LanguageEnglish
Published San Francisco Printed Circuit Engineering Association, Inc 01.10.1999
Subjects
Boundary conditions
CAD
Computer aided design
Computer based modeling
Design
Heat
Heat treating
Libraries
Printed circuit boards
Radiation
Simulation
Software
Thermal energy
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Summary:Thermal analysis of printed circuit board designs is a critical part of the overall design validation process for electronic products. There are several objectives in performing PCB level thermal analysis simulation: 1. to determine if the board or components exceed manufacturing specifications, 2. to predict board and component reliability and durability, and 3. to determine if system requirements are within defined limits. Thermal simulation software should be capable of finding the most successful and cost effective means of removing the excess heat.
ISSN:0884-9862