Electron-Related Phenomena at the TaN / Al 2 O 3 Interface
The goal of this work is to study the transient electrical features of metal/high- k interface in MOS stacks. To this aim, electrons are injected from the gate of TaN / Al 2 O 3 / SiO 2 / p - Si capacitors in pulsed regime. The displacement current flowing during the pulse front is detected, and the...
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Published in | IEEE transactions on electron devices Vol. 57; no. 3; pp. 637 - 643 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
01.03.2010
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Subjects | |
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Abstract | The goal of this work is to study the transient electrical features of metal/high- k interface in MOS stacks. To this aim, electrons are injected from the gate of TaN / Al 2 O 3 / SiO 2 / p - Si capacitors in pulsed regime. The displacement current flowing during the pulse front is detected, and the capacitance is extracted. As a result, for the first time, a flat-band instability related to electron trapping in states near the metal/high- k interface is measured on a millisecond timescale. A picture of the time evolution of the charge density inside the oxide bulk is drawn, with the aid of a finite-element simulator. Reliability of the metal/high- k interface is also investigated by performing stress experiments in pulsed conditions. It is shown that after a certain number of pulses, the creation of new traps at the top interface of the MOS stack becomes relevant. |
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AbstractList | The goal of this work is to study the transient electrical features of metal/high- k interface in MOS stacks. To this aim, electrons are injected from the gate of TaN / Al 2 O 3 / SiO 2 / p - Si capacitors in pulsed regime. The displacement current flowing during the pulse front is detected, and the capacitance is extracted. As a result, for the first time, a flat-band instability related to electron trapping in states near the metal/high- k interface is measured on a millisecond timescale. A picture of the time evolution of the charge density inside the oxide bulk is drawn, with the aid of a finite-element simulator. Reliability of the metal/high- k interface is also investigated by performing stress experiments in pulsed conditions. It is shown that after a certain number of pulses, the creation of new traps at the top interface of the MOS stack becomes relevant. |
Author | Lorenzi, Paolo Ghidini, Gabriella Rao, Rosario Irrera, Fernanda Palma, Fabrizio |
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SubjectTerms | Aluminum Capacitance Devices Instability Metal oxide semiconductors Pictures Stacks Trapping |
Title | Electron-Related Phenomena at the TaN / Al 2 O 3 Interface |
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