Stress evolution in Co sub(x)Fe sub(1-x) (x = 0.33-0.87) electrodeposited films

Electrodeposition of 0.5 km thick Co sub(x)Fe sub(1-x) (x = 0.33-0.87) films was carried out from a sulfate/chloride plating solution containing saccharin as an organic additive at constant current density and a controlled pH 2.3. The increase of Fe super(2+) concentrations in plating solution resul...

Full description

Saved in:
Bibliographic Details
Published inElectrochimica acta Vol. 55; no. 28; pp. 9035 - 9041
Main Authors Tabakovic, Ibro, Gong, Jie, Riemer, Steve, Venkatasamy, Venkatram, Kief, Mark
Format Journal Article
LanguageEnglish
Published 01.12.2010
Subjects
Adsorption
Desorption
Evolution
Plating
Stresses
Surface layer
Tensile stress
Texture
Online AccessGet full text

Cover

More Information
Summary:Electrodeposition of 0.5 km thick Co sub(x)Fe sub(1-x) (x = 0.33-0.87) films was carried out from a sulfate/chloride plating solution containing saccharin as an organic additive at constant current density and a controlled pH 2.3. The increase of Fe super(2+) concentrations in plating solution resulted in an increase of Fe-content and tensile stress in Co sub(x)Fe sub(1-x) films, which is accompanied by a decrease of plating rate. Several possible origins for generation of tensile stress include the following: interfacial stress between CoFe films and Cu-substrate, crystal texture and grain size, coalescence and stress evolution during film growth, and hydrogen adsorption/desorption. The adsorption/desorption mechanism of hydrogen seems to be the most likely dominant stress mechanism. The relationship between increase of the tensile stress and decrease of plating rate was discussed.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
content type line 23
ObjectType-Feature-1
ISSN:0013-4686
DOI:10.1016/j.electacta.2010.07.100