Reliability Considerations in 3D Stacked Strata Systems

The bonding of multiple silicon strata to form stacked circuits with high bandwidth connections, increased circuit densities, decreased latency and the capability to stack disparate technologies is increasingly gaining interest in the microelectronics industry. Stacking has been demonstrated using b...

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Bibliographic Details
Published inAIP conference proceedings Vol. 1143; pp. 213 - 223
Main Authors Pozder, Scott, Jain, Ankur, Jones, Robert, Huang, Zhihong, Justison, Patrick, Chatterjee, Ritwik
Format Journal Article
LanguageEnglish
Published 07.11.2008
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