SECOND-GEN DIGITAL SELECTED AREA PREPARATION SYSTEM PROVIDES UPGRADED FEATURES

The 2nd generation ASAP-1 IPS from Ultra Tec is a digital sample preparation system designed for precise decapsulation, thinning, and polishing of die, package, module, wafer, and board-level devices. Engineered for high yield and device survivability, it offers sub-micron control in all three axes....

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Bibliographic Details
Published inElectronic device failure analysis Vol. 27; no. 2; p. 34
Main Author Kolasa, Ted
Format Magazine Article
LanguageEnglish
Published Materials Park Electronic Device Failure Analysis Society 01.05.2025
Subjects
Machine vision
Survivability
Touch screens
Online AccessGet full text
ISSN1537-0755
2304-8115

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Summary:The 2nd generation ASAP-1 IPS from Ultra Tec is a digital sample preparation system designed for precise decapsulation, thinning, and polishing of die, package, module, wafer, and board-level devices. Engineered for high yield and device survivability, it offers sub-micron control in all three axes. Key upgrades include dual UHD machine vision cameras, a redesigned touchscreen OS with joystick and encoder controls, auto head lift/lower, fluid control, and enhanced navigation. Additional features include image optimization, stage illumination, metrology tools, and an auto-tilt stage, making it a versatile and user-friendly platform for advanced microelectronic component analysis.
Bibliography:ObjectType-News-1
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ISSN:1537-0755
2304-8115