ISTFA 2023 SYSTEM IN PACKAGE (SIP) USER GROUP

The presentation of the System in Package (SIP) User Group at the ISTFA 2023 is discussed. The group adopted a new user group panel discussion format for 2023 to encourage more interactions between panel members and the audiences. The topic, "Overcome the Challenges in SIP FA," was fully d...

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Bibliographic Details
Published inElectronic device failure analysis Vol. 26; no. 1; p. 42
Main Authors Li, Yan, Tracy, Bryan, Qin, Wentao
Format Magazine Article
LanguageEnglish
Published Materials Park Electronic Device Failure Analysis Society 01.02.2024
Subjects
User groups
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Summary:The presentation of the System in Package (SIP) User Group at the ISTFA 2023 is discussed. The group adopted a new user group panel discussion format for 2023 to encourage more interactions between panel members and the audiences. The topic, "Overcome the Challenges in SIP FA," was fully discussed with active participations from panel members and audiences. SIP FA gaps identified by the FA technical roadmap councils were illustrated by Yan Li from Samsung, which include: 1) AI applications in SIP FI-FA. 2) Challenges related to big SIP package dimension, sample prep, fault isolation, non-destructive imaging. 3) FI and FA tool robustness. Bryan Tracy from Tesla asked a few insightful questions to stimulate dynamic discussions among panelists and audiences relating to the FA roadmap.
Bibliography:content type line 24
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ISSN:1537-0755
2304-8115