ISTFA 2023 FOCUSED ION BEAM (FIB) USER GROUP

Brogden discusses the presentation of the Focused Ion Beam (FIB) UIser Group at the ISTFA 2023. Steve Herschbein presented on the status of FIB-related input to the EDFAS Failure Analysis Technology Roadmap gap analysis council, led by Keith Serrels, NXP Semiconductor. Recently published by EDFAS, t...

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Bibliographic Details
Published inElectronic device failure analysis Vol. 26; no. 1; p. 40
Main Authors Brogden, Valerie, Herschbein, Steve, Wong, Michael, Principe, Edward
Format Magazine Article
LanguageEnglish
Published Materials Park Electronic Device Failure Analysis Society 01.02.2024
Subjects
Chips (memory devices)
Failure analysis
Ion beams
Technology assessment
User groups
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Summary:Brogden discusses the presentation of the Focused Ion Beam (FIB) UIser Group at the ISTFA 2023. Steve Herschbein presented on the status of FIB-related input to the EDFAS Failure Analysis Technology Roadmap gap analysis council, led by Keith Serrels, NXP Semiconductor. Recently published by EDFAS, the FA Technology Roadmap endeavors to capture gaps across all failure analysis areas and examine potential alignment vectors with the CHIPS for America Act. This act allocates more than $50 billion dollars over five years toward restoring US leadership in semiconductor manufacturing and addresses the sobering fact that none of the most advanced logic and memory chips are manufactured at commercial scale in the US.
Bibliography:content type line 24
ObjectType-Feature-1
SourceType-Magazines-1
ISSN:1537-0755
2304-8115