Electroless copper plating - various plating baths and their applications
The focus of this paper is on classification of various Electroless copper plating baths from the reducing agents point of view and their applications. The Electroless copper plating bath is made from combination of copper secondary salt, reducing and mixing agents, pH adjusting and other additives....
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| Published in | Hyōmen gijutsu Vol. 53; no. 1; pp. 15 - 21 |
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| Main Author | |
| Format | Journal Article |
| Language | Japanese |
| Published |
01.01.2002
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| Online Access | Get full text |
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| Summary: | The focus of this paper is on classification of various Electroless copper plating baths from the reducing agents point of view and their applications. The Electroless copper plating bath is made from combination of copper secondary salt, reducing and mixing agents, pH adjusting and other additives. The classification is tabulated and for these chemicals the representative items are provided such as formaldehyde, cobalt salt bath and sodium hypophosphite to name a few. From the electric potential of anodic oxidation aspects, the formaldehyde the metallic catalyzers have less electric potential as follows: Cu > Au > Ag > Pt > Pd > Ni and Co. The application of electroless copper plating includes the EMI protection shield of various electronic device. The plating is done on various engineering plastics such as: PPO, polystyrene, polyester, polycarbonates, ABS and others as explained in details. Several microphotographs display the cross section of electroless copper plated substrates with the features of perturbations and remedy methods. |
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| Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 content type line 23 ObjectType-Feature-1 |
| ISSN: | 0915-1869 |