Plating on POM Resin

• Published in: Jitsumu hyōmen gijutsu Vol. 32; no. 7; pp. 362 - 367
• Main Authors: Ochi, E, Aoki, E
• Format: Journal Article
• Language: Japanese
• Published: 01.07.1985
• ISSN: 0368-2358

The polyoxymethylene resin is a kind of polyether and has excellent fatigue and creep resistance. The variation of strain with stress approximates to that of metals. The POM resin consists of four different types of layer. The top layer is non-crystalline. Beneath this is a layer containing both crystalline and non-crystalline sections. The third layer consists of crystals of fine spherical grains, and the fourth of crystals of coarse spherical grains. Without annealing the resin will contain residual stress, which causes cracks during the etching stage. The degreasing agent should be weakly acidic or weakly alkaline, and used at a high temperature. The purpose of etching is to increase the surface area so that the coating may adhere to it more strongly. After the etching the acid is neutralized with a 3-5% NaOH solution or hot water. The resin surface is activated by the use of a catalyst and accelerator. Chemical nickel is used for chemical plating. The final stage is electroplating. 5 ref.--S.W.