Suppression of Cu sub(3) Sn with Ni in High Cu Containing Sn-Cu Solder Alloys

This research examines the relationship between Cu and Ni concentration and the formation of primary Cu sub(3) Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminati...

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Bibliographic Details
Published inMaterials Science Forum Vol. 857; pp. 53 - 57
Main Authors Nogita, Kazuhiro, Kefford, Benjamin, Read, Jonathan, McDonald, Stuart D
Format Journal Article
LanguageEnglish
Published 01.05.2016
Subjects
Alloys
Copper
COPPER TIN ALLOYS
Intermetallic compounds
Nickel
NUCLEATION
Retarding
SOLDERING ALLOYS
Solders
Tin
TIN ALLOYS (50 TO 99 SN)
Tin base alloys
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Summary:This research examines the relationship between Cu and Ni concentration and the formation of primary Cu sub(3) Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu sub(3) Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu sub(3) Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu sub(3) Sn and Cu sub(6) Sn sub(5), slowing the growth of Cu sub(3) Sn and encouraging primary Cu sub(6) Sn sub(5) nucleation.
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SourceType-Scholarly Journals-1
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ISBN:9783035710205
3035710201
ISSN:0255-5476
1662-9752
DOI:10.4028/www.scientific.net/MSF.857.53