Suppression of Cu sub(3) Sn with Ni in High Cu Containing Sn-Cu Solder Alloys
This research examines the relationship between Cu and Ni concentration and the formation of primary Cu sub(3) Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminati...
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Published in | Materials Science Forum Vol. 857; pp. 53 - 57 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
01.05.2016
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Subjects | |
Online Access | Get full text |
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Summary: | This research examines the relationship between Cu and Ni concentration and the formation of primary Cu sub(3) Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu sub(3) Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu sub(3) Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu sub(3) Sn and Cu sub(6) Sn sub(5), slowing the growth of Cu sub(3) Sn and encouraging primary Cu sub(6) Sn sub(5) nucleation. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 content type line 23 ObjectType-Feature-2 |
ISBN: | 9783035710205 3035710201 |
ISSN: | 0255-5476 1662-9752 |
DOI: | 10.4028/www.scientific.net/MSF.857.53 |