Nanosecond Polarization Switching and Long Retention in a Novel MFIS-FET Based on Ferroelectric [Formula Omitted]

We report the fabrication of completely CMOS-compatible ferroelectric field-effect transistors (FETs) by stabilization of a ferroelectric phase in 10-nm-thin [Formula Omitted]. The program and erase operation of this metal-ferroelectric-insulator-silicon FET (MFIS) with [Formula Omitted] gate stack...

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Bibliographic Details
Published inIEEE electron device letters Vol. 33; no. 2; p. 185
Main Authors Muller, Johannes, Boscke, Tim S, Schroder, Uwe, Hoffmann, Raik, Mikolajick, Thomas, Frey, Lothar
Format Journal Article
LanguageEnglish
Published New York The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 01.02.2012
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Summary:We report the fabrication of completely CMOS-compatible ferroelectric field-effect transistors (FETs) by stabilization of a ferroelectric phase in 10-nm-thin [Formula Omitted]. The program and erase operation of this metal-ferroelectric-insulator-silicon FET (MFIS) with [Formula Omitted] gate stack is compared to the transient switching behavior of a TiN-based metal-ferroelectric-metal (MFM) capacitor. Polarization reversal in the MFM capacitor follows a characteristic time and field dependence for ferroelectric domain switching, leading to a higher switching speed with increasing applied field. Similar observations were made for the material when implemented into an MFIS structure. Nonvolatile switching was observed down to 20-ns pulsewidth, yielding a memory window (MW) of 1.2 V. Further increase in gate bias or pulsewidth led to charge injection and degradation of the MW. Retention measurements for up to [Formula Omitted] suggest a retention of more than ten years.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2011.2177435