Plated-Through-Hole Via Design Specifications for 112G Serial Links

An earlier study of a high layer-count test board using plated-through-hole (PTH) vias and a limited quantity of laser vias was shown to be capable of supporting 112 Gb/s PAM-4 links (or equivalent signaling having 28 GHz (Nyquist) bandwidth). This original board design was then rebuilt using a diff...

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Bibliographic Details
Published inarXiv.org
Main Authors Degerstrom, Michael J, Smutzer, Chad M, Ericson, Richard B, Haider, Clifton R, Gilbert, Barry K
Format Paper
LanguageEnglish
Published Ithaca Cornell University Library, arXiv.org 17.01.2023
Subjects
Circuit boards
Links
Printed circuits
Specifications
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Summary:An earlier study of a high layer-count test board using plated-through-hole (PTH) vias and a limited quantity of laser vias was shown to be capable of supporting 112 Gb/s PAM-4 links (or equivalent signaling having 28 GHz (Nyquist) bandwidth). This original board design was then rebuilt using a different fabricator, and the test results revealed a significant decrease in the bandwidth of the vias. These results led to the development of a set of design specifications that PCB vendors can easily validate, which will ensure that the use of high layer-count boards with PTH technology are viable for emerging 112 Gb/s PAM-4 links.
ISSN:2331-8422