Antimicrobial second skin using copper nanomesh

• Published in: Proceedings of the National Academy of Sciences - PNAS Vol. 119; no. 24; p. 1
• Main Authors: Kim, Jae Joon, Ha, Siyoung, Kim, Lina, Kato, Yutaro, Wang, Yan, Okutani, Chihiro, Wang, Haoyang, Wang, Chunya, Fukuda, Kenjiro, Lee, Sunghoon, Yokota, Tomoyuki, Kwon, Oh Seok, Someya, Takao
• Format: Journal Article
• Language: English
• Published: Washington National Academy of Sciences 14.06.2022
• Subjects: Antiinfectives and antibacterials; Bioengineering; Coliforms; Copper; Cross-infection; E coli; Humidity; Inactivation; Influenza; Skin; Skin temperature; Viruses
• ISSN: 0027-8424; 1091-6490
• DOI: 10.1073/pnas.220083011

The functional support and advancement of our body while preserving inherent naturalness is one of the ultimate goals of bioengineering. Skin protection against infectious pathogens is an application that requires common and long-term wear without discomfort or distortion of the skin functions. However, no antimicrobial method has been introduced to prevent cross-infection while preserving intrinsic skin conditions. Here, we propose an antimicrobial skin protection platform copper nanomesh, which prevents cross-infectionmorphology, temperature change rate, and skin humidity. Copper nanomesh exhibited an inactivation rate of 99.99% for Escherichia coli bacteria and influenza virus A within 1 and 10 min, respectively. The thin and porous nanomesh allows for conformal coating on the fingertips, without significant interference with the rate of skin temperature change and humidity. Efficient cross-infection prevention and thermal transfer of copper nanomesh were demonstrated using direct on-hand experiments.