EFFECT OF TIN ADDITION ON THE PROPERTIES OF ELECTROLESS NI-P COATINGS
One of the advantageous properties of electroless Ni-P coatings is the good solderability, which is utilized in the electronic industry. However, the applied high-temperature required by the soldering process might lead to undesired transformation of the coating structure. Thus, the investigation of...
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Published in | Hungarian materials and chemical sciences and engineering (Online) Vol. 45; no. 1; pp. 50 - 62 |
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Main Authors | , |
Format | Journal Article |
Language | English |
Published |
Miskolc
University of Miskolc
01.01.2020
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Subjects | |
Online Access | Get full text |
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Summary: | One of the advantageous properties of electroless Ni-P coatings is the good solderability, which is utilized in the electronic industry. However, the applied high-temperature required by the soldering process might lead to undesired transformation of the coating structure. Thus, the investigation of the thermal stability of the coating has become more and more important among scientists, as by adding a new, 3rd element to the coating, the stability of the coating's structure can be increased. In our research, the required conditions for the 3rd element were determined based on the hypothesis of kinetic stabilization, and tin (Sn) was found an appropriate alloying element. By adding SnCl2 precursor salt to the bath, the main properties of the coating were investigated, such as chemical composition, thickness and appearance. Based on the experiments, 0.3 g/L SnCl2 was determined as the optimal concentration with the applied bath composition. Subsequently, the thermal behaviour of the formed Ni-P-Sn coating was investigated by Differential scanning calorimetry (DSC) and X-ray diffraction analysis (XRD). |
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ISSN: | 3004-0000 3004-0817 |