Controlling Ag^sub 3^Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying

The microstructure of Sn-3.8Ag-0.7Cu solder balls was studied in terms of zinc content and cooling rate. A comparison of a typical microstructure of Sn-3.8Ag-0.7Cu solder balls solidified at two different cooling rates is shown in Figure 1. The fast-cooling rate ([much greater than] 10°C/s) is assoc...

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Bibliographic Details
Published inJOM (1989) Vol. 56; no. 6; p. 34
Main Authors Kang, Sung K, Da-Yuan, Shih, Donovan, Leonard, Henderson, Donald W
Format Journal Article
LanguageEnglish
Published New York Springer Nature B.V 01.06.2004
Subjects
Alloys
Cooling
Copper
Heat treating
Lead
Localization
Microstructure
R&D
Research & development
Soldering
Solidification
Temperature
United States > US
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Summary:The microstructure of Sn-3.8Ag-0.7Cu solder balls was studied in terms of zinc content and cooling rate. A comparison of a typical microstructure of Sn-3.8Ag-0.7Cu solder balls solidified at two different cooling rates is shown in Figure 1. The fast-cooling rate ([much greater than] 10°C/s) is associated with the as-received solder balls and the very slow cooling rate (0.02°C/s) is provided by a furnace cool.
ISSN:1047-4838