Ag^sub 3^Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

The near-eutectic ternary Sn-Ag-Cu alloys yield three phases upon solidification: [beta]-Sn, Ag^sub 3^Sn, and Cu^sub 6^Sn^sub 5^. Attempts to characterize the solidification behavior and define the ternary eutectic composition in the Sn-Ag-Cu system have been reported by several investigators.3,4,6...

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Bibliographic Details
Published inJOM (1989) Vol. 55; no. 6; p. 61
Main Authors Kang, Sung K, Choi, Won Kyoung, Da-Yuan, Shih, Henderson, Donald W
Format Journal Article
LanguageEnglish
Published New York Springer Nature B.V 01.06.2003
Subjects
Alloys
Cooling
Crack propagation
Electronics industry
Localization
Metal fatigue
Silver
Solidification
Thermal cycling
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Summary:The near-eutectic ternary Sn-Ag-Cu alloys yield three phases upon solidification: [beta]-Sn, Ag^sub 3^Sn, and Cu^sub 6^Sn^sub 5^. Attempts to characterize the solidification behavior and define the ternary eutectic composition in the Sn-Ag-Cu system have been reported by several investigators.3,4,6 Using differential-thermal analysis (DTA) methods,3 it was reported that Ag^sub 3^Sn plate nucleation and ensuing growth may occur with minimal undercooling.
ISSN:1047-4838