Plasma-Deposited Fluorocarbon Films: Insulation Material for Microelecfrodes and Combined Atomic Force Microscopy-Scanning Electrochemical Microscopy Probes

Pinhole-free insulation of micro- and nanoelectrodes is the key to successful microelectrochemical experiments performed in vivo or in combination with scanning probe experiments. A novel insulation technique based on fluorocarbon insulation layers deposited from pentafluoroethane (PFE, ...) plasmas...

Full description

Saved in:
Bibliographic Details
Published inAnalytical chemistry (Washington) Vol. 80; no. 13; p. 5260
Main Authors Wiedemair, Justyna, Balu, Balamurali, Moon, Jong-Seok, Hess, Dennis W, Mizaikoff, Boris, Kranz, Christine
Format Journal Article
LanguageEnglish
Published Washington American Chemical Society 01.07.2008
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Pinhole-free insulation of micro- and nanoelectrodes is the key to successful microelectrochemical experiments performed in vivo or in combination with scanning probe experiments. A novel insulation technique based on fluorocarbon insulation layers deposited from pentafluoroethane (PFE, ...) plasmas is presented as a promising electrical insulation approach for microelectrodes and combined atomic force microscopy-scanning electrochemical microscopy (AFM-SECM) probes. The deposition allows reproducible and uniform coating, which is essential for many analytical applications of micro- and nanoelectrodes such as, e.g., in vivo experiments and SECM experiments. Disk-shaped microelectrodes and frame-shaped AFM tip-integrated electrodes have been fabricated by postinsulation focused ion beam (FIB) milling. The thin insulation layer for combined AFM-SECM probes renders this fabrication technique particularly useful for submicro insulation providing radius ratios of the outer insulation versus the disk electrode (RG values) suitable for SECM experiments. Characterization of PFE-insulated AFM-SECM probes will be presented along with combined AFM-SECM approach curves and imaging. (ProQuest: ... denotes formulae/symbols omitted.)
ISSN:0003-2700
1520-6882