Modeling of the Peeling Process of Pressure-sensitive Adhesive Tapes with the Combination of Maxwell Elements

A simple model for the peeling process of pressure-sensitive adhesive tape is presented. The model consists of linear springs and dashpots and can be solved analytically. Based on the modeling, the curved profile of the peeling tape is spontaneously determined in terms of viscoelastic properties of...

Full description

Saved in:
Bibliographic Details
Published inarXiv.org
Main Authors Sato, Katsuhiko, Toda, Akihiko
Format Paper
LanguageEnglish
Published Ithaca Cornell University Library, arXiv.org 30.06.2004
Subjects
Adhesives
Dependence
Modelling
Peeling
Substrates
Viscoelasticity
Online AccessGet full text

Cover

More Information
Summary:A simple model for the peeling process of pressure-sensitive adhesive tape is presented. The model consists of linear springs and dashpots and can be solved analytically. Based on the modeling, the curved profile of the peeling tape is spontaneously determined in terms of viscoelastic properties of adhesives. Using this model, two experimental results are discussed: critical peel rates in the peel force and the peel rate dependence of the detachment process of adhesive from the substrate.
ISSN:2331-8422
DOI:10.48550/arxiv.0406746