Sputtered Silicon as a Potential Masking Material for Glass Micromachining - A Feasibility Study

Present paper reports use of sputtered silicon as a masking material for glass micromachining with hydrofluoric acid (HF) as an etchant. A film of sputtered silicon (sp-Si) having thickness of ~1.4 µm was deposited on glass substrate using DC sputtering system. Sp-Si was patterned using standard pho...

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Bibliographic Details
Published inSensors & transducers Vol. 103; no. 4; p. 155
Main Authors Joshi, Abhay B, Bodas, Dhananjay, Gangal, S A
Format Journal Article
LanguageEnglish
Published Toronto IFSA Publishing, S.L 01.04.2009
Subjects
Adhesion
Experiments
Microelectromechanical systems
Plasma etching
Silicon wafers
Surface roughness
Titanium nitride
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Summary:Present paper reports use of sputtered silicon as a masking material for glass micromachining with hydrofluoric acid (HF) as an etchant. A film of sputtered silicon (sp-Si) having thickness of ~1.4 µm was deposited on glass substrate using DC sputtering system. Sp-Si was patterned using standard photolithographic technique. Glass was etched in HF with varying concentration, to estimate masking behavior of sp-Si. Effect of concentration of HF on sp-Si was studied. Etch depth of 460 µm was obtained with dilute HF (20 %) etchant. [PUBLICATION ABSTRACT]
ISSN:2306-8515
1726-5479