RTP requirements to yield univorm and repeatable ultra-shallow junctions with low energy boron and BF2 ion implants

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Bibliographic Details
Published inJournal of electronic materials Vol. 27; no. 12; p. 1291
Main Authors Marcus, Steven, Lerch, Wilfried, Downey, Daniel F, Todorov, Stanislov, Chow, Judy
Format Journal Article
LanguageEnglish
Published Warrendale Springer Nature B.V 01.12.1998
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ISSN:0361-5235
1543-186X