Effects of Cu incorporation as an acceptor on the thermoelectric transport properties of Cu^sub x^Bi^sub 2^Te^sub 2.7^Se^sub 0.3^ compounds

• Published in: Journal of alloys and compounds Vol. 696; p. 213
• Main Authors: Jeong, Mahn, Tak, Jang-yeul, Lee, Soonil, Seo, Won-Seon, Cho, Hyung Koun, Lim, Young Soo
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier BV 05.03.2017
• Subjects: Charge transport; Copper; Density of states; Figure of merit; Generators; Operating temperature; Plasma sintering; Thermal energy; Thermoelectricity; Transport properties

We report the effects of Cu incorporation on the thermoelectric transport properties in n-type CuxBi2Te2.7Se0.3 (0 ≤ x ≤ 0.08) compounds. The acceptor roles of Cu in the compounds were elucidated by the charge and thermal transport properties. Considerable change in the density of state (DOS) effect...