Effects of Cu incorporation as an acceptor on the thermoelectric transport properties of Cu^sub x^Bi^sub 2^Te^sub 2.7^Se^sub 0.3^ compounds
We report the effects of Cu incorporation on the thermoelectric transport properties in n-type CuxBi2Te2.7Se0.3 (0 ≤ x ≤ 0.08) compounds. The acceptor roles of Cu in the compounds were elucidated by the charge and thermal transport properties. Considerable change in the density of state (DOS) effect...
Saved in:
Published in | Journal of alloys and compounds Vol. 696; p. 213 |
---|---|
Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
Lausanne
Elsevier BV
05.03.2017
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | We report the effects of Cu incorporation on the thermoelectric transport properties in n-type CuxBi2Te2.7Se0.3 (0 ≤ x ≤ 0.08) compounds. The acceptor roles of Cu in the compounds were elucidated by the charge and thermal transport properties. Considerable change in the density of state (DOS) effective mass depending on the Cu content was evidenced by the cross-over of Seebeck coefficients, and the effects of the DOS effective mass on the thermoelectric transport properties were interpreted by temperature-normalized Pisarenko plot. Significant enhancement of thermoelectric figure of merit and the control of optimum operating temperature could be achieved by the Cu incorporation, and their origins were discussed. |
---|---|
ISSN: | 0925-8388 1873-4669 |